| PART |
Description |
Maker |
| 449-10-212 449-10-212-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-206-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-164 349-10-164-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-105-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-106-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 335-40-132-00-160000 |
Interconnect Header .100 Grid; Straight Pin Header .018 Pin Head with Solder Tail; Low Profile Single Row
|
Mill-Max Mfg. Corp.
|
| 0901210768 90121-0768 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail
2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 829-22-018-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-002-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-004-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
